22-28 July 2012: ICCE-20 Beijing, China

20th Annual Int. Conference on Composites, Nano or Metals Engineering
CALL FOR SHORT PAPERS: ICCE-20 Beijing, China
www.icce-nano.org

We have received overwhelming responses and appreciations of highly successful ICCE-20 conference in composites or nano or metal engineering, attended by many eminent scientists and engineers.  We will celebrate our 20th anniversary, two decades, of the series of ICCE conferences.

Your work is of great interest to many researchers in chemistry, physics, biology and engineering of.  Nano materials and composite materials.  In view of your research reputation, I personally invite you to present a paper at the coming ICCE-20 conference in Beijing, a city known all over the world as the political and cultural capital of China.  Please inform interested friends to present papers.

Interested author should IMMEDIATELY submit tentative paper title (changeable later)  by email to David Hui, so that we can send you more information.  The short paper should be written, by following the format in web page. 

Please apply for travel funds and passport visa early, since this can take time, and inform interested friends to present papers. Due to budgetary constraints, we are unable to offer financial assistance, nor offer reduction in registration fee.  We allow only one paper per presenter, additional fee applies for second paper.

The ICCE-20 registration fee is very reasonable for a five-day conference, US$390 before May 22, 2012,with reduced rate for students US$200 before May 22, 2012.  You are encouraged to inform interested friends to present papers. If you wish to develop sessions, please contact me. When you reply, please do not assume your email will reach me until I will reply to you.

All ICCE-20 Beijing, China two-page short papers will be reviewed and then published in special issue of journal, containing over 1000 pages.  Authors are encouraged to submit full length papers to be reviewed and published in selected SCI journals which I am serving on the editorial boards, such as  Current Nanoscience journal, Int. Journal of Nanotechnology,  Journal of Nanomaterials, Int. Journal of Mechanical Sciences, Composites B journal, Textile Research Journal, Journal of Mining and Metallurgy section B Metallurgy, Int J of Mechanical Sciences, among others. Season’s Greeting.

David Hui
New Orleans, USA    
dhui8989@gmail.com